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Hoy me contesta el chino, sobre la máscara antisoldante. Bueno, me indica todas las condiciones sobre los mínimos aceptables del diseño del PCB, y lo que entiendo concretando es que lo mínimo que pueden trazar, sean pistas, máscara antisoldante o lo que sea, debe de ser de un grosor mínimo de 6 mil, vías mínimo de 12 mil, separación al borde de la placa mínimo 20 mil.
Así que si quiero máscara antisoldante entre pines, tendré que adelgazar los pad del TQFP100 y configurar las máscaras en Eagle, para que cumpla con los requisitos mínimo. De todas formas voy a probar con el stencil que me llegó ayer, y si ya no me salen cortos, ya no toco nada, si sale alguno si que adelgazaré pads y meteré máscara entre pines.
" Class production from first-class design, our production can not leave you with the design, to fully cooperate with you and please press Jia Li Chong engineer manufacturing production process to design Detailed First, the relevant design parameters Detailed:
1. The minimum line width: 6mil (0.153mm). That is, if the line width is less than 6mil will not be produced, if the design conditions permit, the bigger the better design, line width from large factory production, the better, the higher the yield is generally conventional in design 10mil around this point is very important, we must design consider
2. Minimum line spacing: 6mil (0.153mm) .. Min.Trace.Spacing is the line-to-line, line-to-pad distance not less than 6mil from the production point of view, the bigger the better, in general routine 10mil, of course, under the design conditions, the bigger the better this is very important, design must consider
3. line to the contour line spacing 0.508mm (20mil)
two. via through-hole (contact hole is commonly known)
4. Minimum aperture: 0.3mm (12mil)
5. Minimum vias (VIA) pore size of not less than 0.3mm (12mil), the pads can not be less than unilateral 6mil (0.153mm), preferably more than 8mil (0.2mm) is not limited to large (see Figure 3) this is very important , the design must consider
6. vias (VIA) hole to hole spacing (hole edge to hole edge) is not less than: 6mil preferably greater than 8mil this point is very important, the design must consider
7, to outline pad pitch 0.508mm (20mil) "